What Challenges Do PCB Design of Power Products Face

At present, with the rapid development of scientific and technological products, the PCB design of power products is facing greater challenges, mainly including power conversion efficiency, thermal analysis, power plane integrity and EMI (electromagnetic interference).

With the increasingly wide and diversified application in the industry, power products are also developing in the direction of high frequency, high efficiency, high density, low voltage, high current and diversification. At the same time, the packaging structure and overall dimensions of power products are becoming more and more standardized to meet the requirements of the global integrated market.

The first is the power conversion efficiency. Conversion efficiency refers to the ratio of the output power of the power supply to the input power actually consumed. In practical application, if the electric energy can not be completely converted, there will be a certain energy consumption. Therefore, no matter which circuit, there must be efficiency problems in power conversion. For linear power supply, the heat dissipation of LDO needs to be considered; For switching power supply, the loss of switching tube should be considered.

Secondly, energy loss will inevitably produce heat, which involves the problem of heat dissipation. In addition, as the load becomes heavier, the power consumption of the power chip increases. Therefore, the heat distribution has to be considered in the power design.

Another is the power plane integrity design. To maintain the integrity of the power supply is to maintain the stable power supply of the power supply. In practical systems, there are always noises of different frequencies. For example, PWM natural frequency or PFM variable frequency control signal, fast di / dt will produce current fluctuation signal, so a low impedance power plane design is necessary.

Finally, EMI (electromagnetic interference) problem. Switching power supply will produce switching noise when it is constantly turned on and off. If the loop inductance is not considered in the design process, excessive return path will produce EMI problem.

The industry has been looking for ways to improve the success rate of Power PCB design. Experience shows that in the design process, if the possible risks can be predicted and avoided in advance, the success rate will be greatly improved. Therefore, it is particularly important to choose an appropriate design simulation tool.

What Challenges Do PCB Design of Power Products Face 1

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